CPU 封裝分層，金屬頂蓋下的秩序

A generic CPU package in a restrained exploded 3D technical concept: metal heat spreader, thin thermal interface, central silicon die and green substrate separated vertically above a simplified socket. Dark blueprint-blue background with sparse nontext grid lines, precise parallel alignment and soft copper highlights, no model names, dimensions or transistor claims. Original generic design, no real brand or fabricated specifications.

通用CPU封裝的剋制分層3D技術概念圖：金屬頂蓋、薄導熱介面、中央矽晶片與綠色基板豎向分離，下方簡化插座。深藍圖背景、疏朗無字網格，平行對齊與柔銅色高光，無型號、尺寸和電晶體引數。 原創通用設計，不虛構真實品牌引數。