CPU 封装分层，金属顶盖下的秩序

A generic CPU package in a restrained exploded 3D technical concept: metal heat spreader, thin thermal interface, central silicon die and green substrate separated vertically above a simplified socket. Dark blueprint-blue background with sparse nontext grid lines, precise parallel alignment and soft copper highlights, no model names, dimensions or transistor claims. Original generic design, no real brand or fabricated specifications.

通用CPU封装的克制分层3D技术概念图：金属顶盖、薄导热界面、中央硅芯片与绿色基板竖向分离，下方简化插座。深蓝图背景、疏朗无字网格，平行对齐与柔铜色高光，无型号、尺寸和晶体管参数。 原创通用设计，不虚构真实品牌参数。